Silicon Carbide Hexagonal Ceramic Tile with NIJ Level III Protection 50mm Flat Hexagon Pressureless Sintered SiC

제품 상세 정보:

원래 장소: 중국 후난성
브랜드 이름: WNRLN
인증: ISO 9001:2015, NIJ 0101.06
모델 번호: 원문 타일
문서: SIC Ballistic Armor Tiles-P...ad.pdf

결제 및 배송 조건:

최소 주문 수량: 100000 조각
가격: USD 0.1-1 / Piece
포장 세부 사항: EPE 폼 트레이 + 진공 밀봉 백 + 수출용 합판 케이스
배달 시간: 재고 보유 기간은 영업일 기준 5~7일, 생산 기간은 15~20일
지불 조건: T/T,L/C,웨스턴 유니온
공급 능력: 달 당 5000000 조각
최고의 가격 접촉

상세 정보

밀도: 3.10-3.15g/cm3 경도(GPa): 24-27
굴곡강도: 380-450MPa 타일 ​​크기: 50mm 평면 대 평면 육각형
면적 밀도: ≤34kg/m²(어레이) 파괴 인성: 3.5~4.5MPa·m½
강조하다:

Hexagonal SiC Ballistic Tile

,

Mosaic Array Strike Face

,

NIJ III Ceramic Protection

제품 설명

Silicon Carbide Hexagonal Ceramic Ballistic Tile Mosaic Array NIJ Level III Protection Strike Face 50mm Flat Hexagon
SiC Hexagonal Ceramic Ballistic Tile
Mosaic Array Strike Face | 50mm Flat Hex | NIJ Level III
✅ Optimal Packing Density ✅ Reduced Gap Coverage
Why Hexagonal Geometry?
Traditional square tiles leave cross-shaped seams at every corner intersection—potential weak points. The WNRLN SC-50HEX-PS3 hexagonal tile distributes seam lines in a honeycomb pattern, eliminating continuous straight-line gaps. This geometric advantage provides 12-18% higher ceramic coverage density compared to equivalent square tile arrays. Each hex tile is precision-ground to ±0.2mm dimensional tolerance for consistent gap control in automated array assembly.
Hex vs Square: Coverage Density
Hexagonal tiles achieve ~90.7% geometric packing efficiency vs ~78.5% for squares of equivalent area, resulting in fewer vulnerable seam intersections and improved multi-hit resistance across the array.
SiC Hex vs B4C Hex: Cost
Atmospheric sintered SiC hex tiles cost 50-60% less than equivalent hot-pressed B4C hex tiles while delivering 90% of the ballistic performance. The ideal choice for cost-sensitive volume programs.
SiC vs Al2O3 Hex: Weight
At equivalent thickness, SiC hex arrays weigh 16-20% less than Al2O3 hex arrays. This weight saving compounds across larger panel assemblies for vehicle and personnel applications.
Seamless Multi-Tile Integration
Consistent edge chamfer (0.3mm x 45°) on all tiles ensures uniform adhesive bonding gap. Compatible with epoxy, polyurethane, and polysulfide adhesive systems for composite lamination.
Technical Specifications
Material Pressureless Sintered SiC
Shape Regular Hexagon (Flat-to-Flat)
Flat-to-Flat Width 50.0 ± 0.2 mm
Thickness 8.0 mm (6-12mm optional)
Edge Chamfer 0.3mm x 45°
Surface Finish Ground (Ra ≤ 0.8μm)
Density 3.10-3.15 g/cm³
Hardness 2500-2800 HV
Order hexagonal SiC tiles for your mosaic array system today
Email: janehu@hbnewmaterial.com | Custom hex sizes and thickness available

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