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6mm Ultra-Thin Silicon Carbide Ceramic Tile with NIJ Level III Protection and High Density Microstructure
제품 상세 정보:
| 원래 장소: | 중국 후난성 |
| 브랜드 이름: | High Broad |
| 인증: | ISO 9001:2015, NIJ 0101.06 |
| 모델 번호: | 원문 타일 |
| 문서: | SIC Ballistic Armor Tiles-P...ad.pdf |
결제 및 배송 조건:
| 최소 주문 수량: | 1000개 |
|---|---|
| 가격: | USD 0.1-1 / Piece |
| 포장 세부 사항: | 개별 EPE 폼 인서트 + 진공 밀봉된 정전기 방지 백 + 수출용 합판 케이스 |
| 배달 시간: | 재고 보유 기간은 영업일 기준 5~7일, 생산 기간은 15~20일 |
| 지불 조건: | T/T,L/C,웨스턴 유니온 |
| 공급 능력: | 달 당 2500000 조각 |
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상세 정보 |
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| 밀도: | 3.12-3.18g/cm³ | 경도(GPa): | 25-28 |
|---|---|---|---|
| 굴곡강도: | 400-480MPa | 타일 크기: | 100x100mm |
| 면적 밀도: | 28kg/m² 이하 | 파괴 인성: | 3.8~4.8MPa·m½ |
| 강조하다: | Ultra Thin SiC Tile,Lightweight Strike Face Plate,NIJ III Thin Armor Ceramic |
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제품 설명
- 6mm Ultra-Thin Profile
- High Density Microstructure
The HB achieves NIJ Level III protection with just 6mm ceramic thickness—a 25% reduction from standard 8mm tiles. This is made possible through our advanced high-density pressureless sintering process that produces SiC with 3.15+ g/cm³ density and 2600+ HV hardness, approaching hot-pressed density values without the associated cost premium. The result: armor systems that are significantly lighter and thinner without compromising protection.
| Ceramic Type | Required Thickness | Areal Density @ NIJ III | Weight Index |
|---|---|---|---|
| HB SiC (6mm high-density) | 6.0 mm | ≤ 28 kg/m² | ★★★ Best |
| Standard SiC (8mm) | 8.0 mm | ~36 kg/m² | ★★ Good |
| Alumina Al2O3 (10mm) | 10.0 mm | ~42 kg/m² | ★ Heavy |
| Boron Carbide B4C (6mm) | 6.0 mm | ~22 kg/m² | ★★★★ Lightest (High Cost) |
WNRLN 6mm SiC achieves the optimal balance: B4C-level thinness at 50-60% lower cost.
Our controlled-atmosphere pressureless sintering process achieves 98.5%+ theoretical density with minimal porosity (<0.5%), enabling the thinner profile without strength compromise.
The 6mm ultra-thin profile and 28 kg/m² areal density make this tile ideal for helicopter crew seats, vehicle spall liners, and portable shield applications where weight budget is critical.
Double-side ground to ≤20μm flatness and ≤0.8μm Ra surface finish, ensuring uniform adhesive bond line thickness across the entire tile surface.
Despite the thin profile, enhanced fracture toughness (3.8-4.8 MPa*m½) ensures reliable multi-hit performance. Tested with 3-round triangular shot pattern at 50mm spacing.
Technical datasheets and ballistic test reports available
